Electronic device package

ABSTRACT

Electronic device package technology is disclosed. In one example, an electronic device package can include a substrate, an electronic component disposed on the substrate and electrically coupled to the substrate, and an underfill material disposed at least partially between the electronic component and the substrate. A lateral portion of the underfill material can comprises a lateral surface extending away from the substrate and a meniscus surface extending between the lateral surface and the electronic component.

PRIORITY DATA

This application is a continuation of U.S. patent application Ser. No.15/089,136, filed Apr. 1, 2016, now issued as U.S. Pat. No. 10,249,515,which is incorporated herein by reference.

TECHNICAL FIELD

Embodiments described herein relate generally to electronic devicepackages, and more particularly to controlling the flow of an underfillmaterial over the surface of an electronic device package substrate.

BACKGROUND

Electronic devices, which include a chip component joined to asubstrate, are often vulnerable to crack formation. In particular,cracks tend to appear along the bond lines around attachment structuressuch as bumps, including either between the bump and the component orbetween the bump and the substrate. Cracks may occur in manufacturing oruse when the materials of the substrate and/or electronic device aresubjected to thermal cycling and expand and contract at different rates.Such cracks are a major source of device failure in chip components. Inaddition, mechanical stress due to coefficient of thermal expansion(CTE) mismatch can cause delamination in multiple device stack layers ona die. Underfill techniques and materials are extensively used insemiconductor manufacturing in an effort to stabilize chip componentsand help prevent device failure.

One common underfill technique is “capillary underfill”. Capillaryunderfill typically involves flowing an adhesive material between thecomponent and the substrate, so that it contacts both the component andthe substrate as it is drawn into and through an intervening gap by awicking action. When functioning properly, the underfill will migratecompletely beneath the component, displacing all air and reaching to allthe edges of the chip component. The underfill may then be cured to forma substantially rigid material surrounding and strengthening eachattachment joint. This can allow the materials to better withstand thestresses applied to attachment structure bond lines during thermalvariation, and protect against delamination in multiple device stacklayers on a die. At each edge of the component, a generally concavefillet of underfill material may form, extending from the component tothe substrate surface only a short distance beyond the peripheralboundary of the component.

After it is dispensed, the flowable adhesive may flow not only into andthrough the gap between the component and the substrate, but also awayfrom the dispense point and the component, across the surface of thesubstrate. Once cured, this “counter-directional” flow forms an“extended fillet” of underfill material. This generally unimpeded flowaway from the component necessitates, in many instances, the use of moreunderfill than is necessary to simply fill the component-substrate gap,and the underfill material comprising the extended fillet is essentiallywasted. Further, the area covered by the extended fillet is generallydesignated a “keep out zone” (KOZ) into which no other components areplaced to avoid potentially damaging them. Therefore, on the side of achip component where an extended fillet of underfill material forms, thesubstrate surface area beneath the extended fillet is effectively madeunavailable for component placement and essentially wasted.

BRIEF DESCRIPTION OF THE DRAWINGS

Invention features and advantages will be apparent from the detaileddescription which follows, taken in conjunction with the accompanyingdrawings, which together illustrate, by way of example, variousinvention embodiments; and, wherein:

FIG. 1 illustrates a schematic representation of a side cross-sectionalview of an electronic device package in accordance with an example;

FIG. 2 illustrates a schematic representation of a top view of theelectronic device package of FIG. 1;

FIG. 3 illustrates a schematic representation of a top view of asubstrate in accordance with an example of a method for making anelectronic device package;

FIG. 4 illustrates dispensing material on the substrate of FIG. 3 toform a barrier in accordance with an example of a method for making anelectronic device package;

FIG. 5 illustrates a schematic representation of a side cross-sectionalview of a substrate with a barrier disposed thereon in accordance withan example of a method for making an electronic device package;

FIG. 6 illustrates a schematic representation of a side cross-sectionalview of a substrate with a barrier and an electronic component disposedthereon in accordance with an example of a method for making anelectronic device package;

FIG. 7 illustrates a schematic representation of a side cross-sectionalview of underfill material disposed between an electronic component anda substrate and bounded by a barrier in accordance with an example of amethod for making an electronic device package;

FIG. 8 illustrates a schematic representation of a side cross-sectionalview of an electronic device package following removal of a barrier inaccordance with an example of a method for making an electronic devicepackage;

FIG. 9 illustrates a schematic representation of a side cross-sectionalview of a substrate and an electronic component disposed thereon inaccordance with an example of a method for making an electronic devicepackage;

FIG. 10 illustrates a schematic representation of a side cross-sectionalview of a printing stencil disposed on a substrate in accordance with anexample of a method for making an electronic device package;

FIG. 11 illustrates a schematic representation of a side cross-sectionalview of material transferred through a printing stencil to form abarrier on a substrate about an electronic component in accordance withan example of a method for making an electronic device package;

FIG. 12 illustrates a schematic representation of a side cross-sectionalview of a barrier formed on a substrate about an electronic component inaccordance with an example of a method for making an electronic devicepackage; and

FIG. 13 is a schematic illustration of an exemplary computing system.

Reference will now be made to the exemplary embodiments illustrated, andspecific language will be used herein to describe the same. It willnevertheless be understood that no limitation of the scope or tospecific invention embodiments is thereby intended.

DESCRIPTION OF EMBODIMENTS

Before invention embodiments are disclosed and described, it is to beunderstood that no limitation to the particular structures, processsteps, or materials disclosed herein is intended, but also includesequivalents thereof as would be recognized by those ordinarily skilledin the relevant arts. It should also be understood that terminologyemployed herein is used to describe particular examples only and is notintended to be limiting. The same reference numerals in differentdrawings represent the same element. Numbers provided in flow charts andprocesses are provided for clarity in illustrating steps and operationsand do not necessarily indicate a particular order or sequence. Unlessdefined otherwise, all technical and scientific terms used herein havethe same meaning as commonly understood by one of ordinary skill in theart to which this disclosure belongs.

As used in this specification and the appended claims, the singularforms “a,” “an” and “the” include plural referents unless the contextclearly dictates otherwise. Thus, for example, reference to “a layer”includes a plurality of such layers.

In this disclosure, “comprises,” “comprising,” “containing” and “having”and the like can have the meaning ascribed to them in U.S. Patent lawand can mean “includes,” “including,” and the like, and are generallyinterpreted to be open ended terms. The terms “consisting of” or“consists of” are closed terms, and include only the components,structures, steps, or the like specifically listed in conjunction withsuch terms, as well as that which is in accordance with U.S. Patent law.“Consisting essentially of” or “consists essentially of” have themeaning generally ascribed to them by U.S. Patent law. In particular,such terms are generally closed terms, with the exception of allowinginclusion of additional items, materials, components, steps, orelements, that do not materially affect the basic and novelcharacteristics or function of the item(s) used in connection therewith.For example, trace elements present in a composition, but not affectingthe composition's nature or characteristics would be permissible ifpresent under the “consisting essentially of” language, even though notexpressly recited in a list of items following such terminology. Whenusing an open ended term in the specification, like “comprising” or“including,” it is understood that direct support should be affordedalso to “consisting essentially of” language as well as “consisting of”language as if stated explicitly and vice versa.

The terms “first,” “second,” “third,” “fourth,” and the like in thedescription and in the claims, if any, are used for distinguishingbetween similar elements and not necessarily for describing a particularsequential or chronological order. It is to be understood that the termsso used are interchangeable under appropriate circumstances such thatthe embodiments described herein are, for example, capable of operationin sequences other than those illustrated or otherwise described herein.Similarly, if a method is described herein as comprising a series ofsteps, the order of such steps as presented herein is not necessarilythe only order in which such steps may be performed, and certain of thestated steps may possibly be omitted and/or certain other steps notdescribed herein may possibly be added to the method.

The terms “left,” “right,” “front,” “back,” “top,” “bottom,” “over,”“under,” and the like in the description and in the claims, if any, areused for descriptive purposes and not necessarily for describingpermanent relative positions. It is to be understood that the terms soused are interchangeable under appropriate circumstances such that theembodiments described herein are, for example, capable of operation inother orientations than those illustrated or otherwise described herein.The term “coupled,” as used herein, is defined as directly or indirectlyconnected in an electrical or nonelectrical manner. Objects describedherein as being “adjacent to” each other may be in physical contact witheach other, in close proximity to each other, or in the same generalregion or area as each other, as appropriate for the context in whichthe phrase is used. Occurrences of the phrase “in one embodiment,” or“in one aspect,” herein do not necessarily all refer to the sameembodiment or aspect.

As used herein, the term “substantially” refers to the complete ornearly complete extent or degree of an action, characteristic, property,state, structure, item, or result. For example, an object that is“substantially” enclosed would mean that the object is either completelyenclosed or nearly completely enclosed. The exact allowable degree ofdeviation from absolute completeness may in some cases, depend on thespecific context. However, generally speaking, the nearness ofcompletion will be so as to have the same overall result as if absoluteand total completion were obtained. The use of “substantially” isequally applicable when used in a negative connotation to refer to thecomplete or near complete lack of an action, characteristic, property,state, structure, item, or result. For example, a composition that is“substantially free of” particles would either completely lackparticles, or so nearly completely lack particles that the effect wouldbe the same as if it completely lacked particles. In other words, acomposition that is “substantially free of” an ingredient or element maystill actually contain such item as long as there is no measurableeffect thereof.

As used herein, the term “about” is used to provide flexibility to anumerical range endpoint by providing that a given value may be “alittle above” or “a little below” the endpoint. It is understood thatsupport in this specification for numerical values used in connectionwith the term “about” is also provided for the exact numerical valueitself as though “about” were not used.

As used herein, a plurality of items, structural elements, compositionalelements, and/or materials may be presented in a common list forconvenience. However, these lists should be construed as though eachmember of the list is individually identified as a separate and uniquemember. Thus, no individual member of such list should be construed as ade facto equivalent of any other member of the same list solely based ontheir presentation in a common group without indications to thecontrary.

Concentrations, amounts, sizes, and other numerical data may beexpressed or presented herein in a range format. It is to be understoodthat such a range format is used merely for convenience and brevity andthus should be interpreted flexibly to include not only the numericalvalues explicitly recited as the limits of the range, but also toinclude all the individual numerical values or sub-ranges encompassedwithin that range as if each numerical value and sub-range is explicitlyrecited. As an illustration, a numerical range of “about 1 to about 5”should be interpreted to include not only the explicitly recited valuesof about 1 to about 5, but also include individual values and sub-rangeswithin the indicated range. Thus, included in this numerical range areindividual values such as 2, 3, and 4 and sub-ranges such as from 1-3,from 2-4, and from 3-5, etc., as well as 1, 2, 3, 4, and 5,individually.

This same principle applies to ranges reciting only one numerical valueas a minimum or a maximum. Furthermore, such an interpretation shouldapply regardless of the breadth of the range or the characteristicsbeing described.

Reference throughout this specification to “an example” means that aparticular feature, structure, or characteristic described in connectionwith the example is included in at least one embodiment. Thus,appearances of the phrases “in an example” in various places throughoutthis specification are not necessarily all referring to the sameembodiment.

Furthermore, the described features, structures, or characteristics maybe combined in any suitable manner in one or more embodiments. In thisdescription, numerous specific details are provided, such as examples oflayouts, distances, network examples, etc. One skilled in the relevantart will recognize, however, that many variations are possible withoutone or more of the specific details, or with other methods, components,layouts, measurements, etc. In other instances, well-known structures,materials, or operations are not shown or described in detail but areconsidered well within the scope of the disclosure.

Example Embodiments

An initial overview of technology embodiments is provided below andspecific technology embodiments are then described in further detail.This initial summary is intended to aid readers in understanding thetechnology more quickly but is not intended to identify key or essentialfeatures of the technology nor is it intended to limit the scope of theclaimed subject matter.

For the reasons mentioned above it is highly desirable to minimize oreliminate the underfill KOZ. The benefits of minimizing or eliminatingthe underfill KOZ include the ability to reduce package size andincrease the package lay out density. These advantages and others cansignificantly reduce package cost.

Accordingly, electronic device packages are disclosed in which barriersused to control the flow and spread of underfill material do notcontribute or factor into the underfill KOZ. In one embodiment, this isaccomplished by removing the barriers, which may be facilitated byforming the barriers with sacrificial material, such as material that isreadily decomposed or dissolved. As a result, in one example, anelectronic device package can include a substrate, an electroniccomponent disposed on the substrate and electrically coupled to thesubstrate, and an underfill material disposed at least partially betweenthe electronic component and the substrate. A lateral portion of theunderfill material can comprise a lateral surface extending away fromthe substrate and a meniscus surface extending between the lateralsurface and the electronic component. In another example, an electronicdevice package can include a substrate, an electronic component disposedon the substrate and electrically coupled to the substrate, and anunderfill material disposed at least partially between the electroniccomponent and the substrate. A lateral portion of the underfill materialextends from a lateral side of the electronic component to thesubstrate. The lateral portion of the underfill material can have anedge between two surfaces of the underfill material. In yet anotherexample, an electronic device package can include a substrate, anelectronic component disposed on the substrate and electrically coupledto the substrate, and an underfill material disposed at least partiallybetween the electronic component and the substrate. The underfillmaterial can have a lateral portion that extends from a lateral side ofthe electronic component to the substrate. In addition, the electronicdevice package can include a sacrificial material residue remaining froma barrier on at least one of the substrate and the lateral portion ofthe underfill material.

Referring to FIGS. 1 and 2, an exemplary electronic device package 100is illustrated. In general, the electronic device package 100 caninclude a substrate 110 and an electronic component 120 disposed ormounted on the substrate 110, such as on a top surface 111 of thesubstrate 110. The electronic component 120 can be any electronic deviceor component that may be included in an electronic device package, suchas a semiconductor device (e.g., a die, a chip, or a processor). Thesubstrate 110 is represented generally and may be a multilayer substrateincluding a number of alternating layers of metallization and dielectricmaterial (not shown). Each layer of metallization can comprise a numberof conductors (e.g., traces), and these conductors may comprise anysuitable conductive material, such as copper or a copper alloy. Further,each metal layer can be separated from adjacent metal layers by thedielectric layers, and adjacent metal layers may be electricallyinterconnected by conductive vias. The dielectric layers may compriseany suitable insulating material (e.g., polymers, including boththermoplastic and thermosetting resins or epoxies, ceramics, etc.) andthe alternating layers of metal and dielectric material may be built-upover a core layer of a dielectric material (or perhaps a metallic core).The substrate 110 can also include a solder resist material or othersurface treatment forming an outer layer of the substrate. Theelectronic component 120 can be mounted to the substrate 110 in anysuitable manner, such as using a conventional flip chip technology inwhich solder bumps 112 are located between the electronic component 120and the substrate 110 to electrically couple the electronic component120 and the substrate 110.

The electronic device package 100 can also include an underfill material130 disposed at least partially between the electronic component 120 andthe substrate 110. The underfill material 130 is typically a polymer(e.g., an epoxy) typically applied between the electronic component 120and the substrate 110 as an underfill encapsulant. The underfillmaterial 130 surrounds the solder bumps 112 and acts to protect thebumps and connection between the electronic component 120 and substrate110, as well as support the electronic component 120 on the substrate110. A lateral portion 131 a, 131 b of the underfill material 130 canextend from a lateral side 132 a, 132 b of the electronic component 120to the substrate 110. The lateral portion 131 a, 131 b of the underfillmaterial 130 can have a lateral surface 133 a, 133 b extending away fromthe substrate 110. The lateral portion 131 a, 131 b can also have ameniscus surface 134 a, 134 b extending between the lateral surface 133a, 133 b and the electronic component 120. In one aspect, the lateralsurface 133 a, 133 b, can intersect the meniscus surface 134 a, 134 b.In one aspect, the lateral portion 131 a, 131 b of the underfillmaterial can have an edge 135 a, 135 b between the lateral surface 133a, 133 b and the meniscus surfaces 134 a, 134 b of the underfillmaterial 130. In other words, in some aspects, an intersection of themeniscus surface 134 a, 134 b and the lateral surface 133 a, 133 b candefine the edge 135 a, 135 b.

As described in more detail below, the lateral surface 133 a, 133 b canbe formed by the underfill material 130 interfacing with a barrier thatmechanically inhibits (e.g., physically dams or blocks) the flow andspread of the underfill material outward from the electronic component120. The barrier can be configured to establish or define a “keep outzone” into which no other components are placed, so that such othercomponents can avoid contact with the underfill material, which may beundesirable. Once the underfill material has cured or solidified, thebarrier can be removed, which can facilitate the placement of componentsin the same location where a barrier previously existed. Accordingly, inone aspect, the lateral surface 133 a, 133 b can be exposed due to theremoval of the barrier, although the lateral surface 133 a, 133 b may becovered by a material (e.g., a mold compound) that may encapsulate oneor more components of the package. Thus, in the context of the presentdisclosure, the lateral surface 133 a, 133 b is exposed when thestructure or material that formed or created the surface is absent,notwithstanding a subsequent covering by another material after removalof the formation structure. Such formation structures (e.g., barriers)can be made in any suitable manner, some examples of which are disclosedherein. In some embodiments, barriers can be formed in a manner thatcreates an uneven or irregular surface that interfaces with theunderfill material. Thus, the lateral surface resulting from aninterface with such a material can also have an uneven or irregularsurface. A barrier can be located in any suitable position relative tothe electronic component 120. In some cases, the barrier can dam orblock the flow of the underfill material 130 such that a height 102 ofthe lateral surface 133 a from the substrate 110 is greater than a gap103 between the electronic component 120 and the substrate 110. Tofacilitate removal of the barrier or lateral surface formationstructure, such structures can be made of a sacrificial material.Because the barrier or lateral surface formation structure is removed, asacrificial material residue (e.g., trace material or a stain) 141 a,141 b can remain from the barrier on the substrate 110 and/or thelateral portion 131 a, 131 b of the underfill material 130 (e.g., thelateral surface 133 a, 133 b).

FIGS. 3-12 illustrate aspects of exemplary methods or processes formaking an electronic device package, such as the electronic devicepackage 100. These figures also illustrate aspects of a method forfacilitating an underfill material keep out zone of an electroniccomponent.

FIG. 3 schematically illustrates a top view of a substrate 210 to whichan electronic component can be coupled. The substrate 210 can have anelectronic component attachment area 214, shown bounded by a dotted linein the figure. The electronic component attachment area 214 is the areaon the substrate that will be covered by an electronic component (whenviewed from above) when the electronic component is coupled to thesubstrate 210. Disposed within the electronic component attachment area214 on the substrate 210 are electrically conductive terminals (notshown), such as an array of pads or lands that are arranged to mate witha corresponding array of terminals formed on the electronic component(e.g., to be flip-chip mounted on the substrate 210). Conductiveterminals may comprise copper (or a copper alloy or other metal) pads.It should be understood that the disclosed embodiments are not limitedto substrates adapted for flip-chip bonding and, further, thatelectrically conductive terminals may comprise any type of terminal orelement that may be used to form an electrical connection with anelectronic component (e.g., bond pads for wire bonding, etc.).

The substrate 210 can also have an electronic component region 215. Theelectronic component region 215 is shown bounded by a dotted line inFIG. 3 and represents a boundary of where underfill material may flow orspread on the substrate 210 during subsequent processing. The electroniccomponent attachment area 214 is typically within the electroniccomponent region 215, and therefore the electronic component may bemounted on the substrate 210 within the electronic component region 215.The area between the dotted lines representing the electronic componentregion 215 and the electronic component attachment area 214 may bereferred to as an underfill KOZ 216.

As seen in the top view of FIG. 4, a barrier 240 can be formed on asurface 211 of the substrate 210 about at least a portion of theelectronic component region 215. The barrier 240 can control the flowand spread of an underfill material and, hence, inhibit the flow of theunderfill material and thereby establish or maintain the underfill KOZ216 on the substrate surface. By physically blocking or dammingunderfill flow, the size and boundaries of the KOZ 216 can be minimizedand maintained, which may be beneficial for small form factor packages.

The barrier 240 can comprise any structure suitable for physicallyblocking the flow and spread of an underfill material. In oneembodiment, the barrier 240 can be arranged in a pattern that at leastpartially defines KOZ 216 or that otherwise mechanically inhibits orprevents the flow or spread of underfill material beyond the KOZ 216.For example, as shown in FIG. 4, the barrier 240 may be arranged in apattern that fully surrounds (or at least substantially surrounds) aperimeter of the electronic component region 215. In another example,the barrier 240 can be arranged about fewer than all sides of theelectronic component region 215, such as in a single bead or line alongone side of the electronic component region 215, to at least partiallydefine the KOZ 216. It should be understood that the barrier 240 may bearranged in any desired pattern or configuration, and the pattern thatis used may be a function of several factors (e.g., the package formfactor, die size, underfill viscosity, the process flow, etc.). Inaddition, the barrier 240 can be formed to have any suitable dimension(e.g., wall height and width). If needed, a subsequent process (e.g., ascanning laser burning/ablation process) can be used to re-shape thebarrier 240 to achieve required dimensions.

As discussed in more detail below, the barrier 240 can be formed of amaterial that facilitates removal of the barrier once the underfillmaterial has cured or solidified. Thus, the barrier 240 may be made of asacrificial material that is thermally decomposable or liquid (e.g.,water), or gas, soluble, for example. The barrier 240 can be formed bydisposing material on the surface 211 of the substrate 210 utilizing anysuitable process or technique. For example, as illustrated in FIG. 4,the barrier 240 can be formed by dispensing material (e.g., sacrificialmaterial) on the surface 211 of the substrate 210, such as with a needleor nozzle dispenser 250. The needle or nozzle dispenser 250 can be movedrelative to the substrate 210 to trace out the desired pattern of thebarrier 240. In one aspect, the needle or nozzle dispenser 250 may bemade of material that is non-wet to sacrificial materials or is surfacecoated with a non-wet material.

It should be recognized that the barrier 240 can be formed prior to orafter an electronic component has been disposed on the substrate 210.For example, FIG. 5 illustrates a side view of the barrier 240 on thesubstrate 210 without an electronic component, and FIG. 6 illustrates aside view of the barrier 240 on the substrate 210 with an electroniccomponent 220 that may have been disposed on the substrate 210 before orafter the formation of the barrier 240. Accordingly, in one aspect, FIG.5 illustrates an electronic device package precursor, which includes asubstrate having an electronic component region as described above, anda sacrificial material disposed on the substrate to form a barrier aboutat least a portion of the electronic component region to mechanicallyinhibit flow of an underfill material. In another aspect, FIG. 6illustrates an electronic device package precursor that further includesan electronic component disposed on the substrate and electricallycoupled to the substrate, such as through solder bumps 212. Each ofthese electronic device package precursors can be subjected to furtherprocessing to create an electronic device package in accordance with thepresent disclosure as described below.

For example, as shown in FIG. 7, underfill material 230 can be disposedat least partially between the electronic component 220 and thesubstrate 210. The underfill material 230 can be disposed between theelectronic component 220 and the substrate 210 utilizing any suitableprocess or technique, such as dispensing. Typically, the underfillmaterial 230 would be dispensed onto the substrate 210 in a region 218between the barrier 240 and a lateral side of the electronic component220. The underfill material 230 may flow between the electroniccomponent 220 and the substrate 210 using capillary action.

The underfill material 230 can form a mechanical bond between theelectronic component 220 and the substrate 210, and may also providesupport to, and increase the strength of, the electrical connectionformed by the solder bumps 212. The underfill material 230 may compriseany material capable of performing one or more of the above-described aswell as other functions. In one embodiment, the underfill material 230comprises an epoxy, such as a polymer epoxy. When formed from an epoxymaterial, the underfill material 230 is then typically cured to hardenthe polymer.

As shown in FIG. 7, the barrier 240 mechanically inhibits the flow ofthe underfill material 230. For example, in the illustrated embodiment,the underfill material 230 can flow or spread across the substrate 210surface up to the barrier 240, but the barrier 240 dams or blocks thecontinued outward flow of the underfill material 230. In one aspect, thebarrier 240 can be configured such that the underfill material 230 doesnot cross over the barrier 240. For example, as shown in FIG. 6, aheight 204 a, 204 b of the barrier 240 from the substrate 210 is greaterthan a gap 203 between the electronic component 220 and the substrate210. With such a barrier configuration, when the underfill material 230is disposed between the electronic component 220 and the substrate 210,as shown in FIG. 7, flow of the underfill material 230 is mechanicallyinhibited or physically blocked by the barrier 240. Thus, as shown inFIG. 7, a lateral surface 233 a can extend away from the substrate 210,and a height 202 a of the lateral surface 233 a from the substrate isgreater than the gap 203 between the electronic component 220 and thesubstrate 210. The height 202 a of the lateral surface 233 a may differfrom a height 202 b of a lateral surface 233 b extending from thesubstrate 210 on another side of the electronic component 220. Such aheight difference may be due to the relative spacing between the barrier240 and the electronic component 220 on the different sides of theelectronic component. Such spacing differences may exist for any reason,such as to provide a suitable space or region 218 in which to deposit ordispense the underfill material 230 between the barrier 240 and theelectronic component 220.

In one aspect, FIG. 7 also illustrates an electronic device packageprecursor, which in this case further includes the underfill material230 disposed at least partially between the electronic component 220 andthe substrate 210. The underfill material 230 has a lateral surface 233a, 233 b defined at least in part by the barrier 240.

The barrier 240 may be positioned to permit whatever amount of spreadingof the underfill material 230 is desired. For example, in certainapplications, it may be useful to have the underfill material 230 spreada small, uniform distance outward from the electronic componentattachment area, for protection. In other applications it may be usefulto minimize or have no underfill spread beyond the electronic componentattachment area, or to provide for different amounts of underfill spreadon different sides of the electronic component attachment area. Bycontrolling or limiting the extent of the flow of the underfill material230 using the barrier 240, the size and boundary of the underfill KOZcan be minimized and/or maintained.

It should be appreciated that the exact position and shape of thebarrier 240 may be varied from that shown in FIGS. 4-7. Depending onfactors including, for example, the size of the substrate and thepresence of other structures on the substrate, the underfill KOZ can beconfigured to any desired shape and any desired size outside of theelectronic component attachment area (even down to zero on all sides),by controlling the location, shape, and size of the barrier 240 formedoutside of the electronic component attachment area. In one embodiment,the barrier may be formed along one side, two sides, three sides, orfour sides of the electronic component. In some cases, the barrier maybe form an open perimeter and in other cases the barrier may form aclosed perimeter. In an additional embodiment, the barrier can take anyshape required in order to achieve a specific result, such asrectangular, square, circular, oval, pentagonal, hexagonal, octagonal,or the like. The barrier can also be formed to any thickness, height, orcross-sectional shape or configuration desired. It should also beappreciated that the electronic component attachment area may havemultiple configurations, for example, more or less than four sides,depending on the shape of the electronic component.

In one aspect, a barrier can be used to mechanically inhibit or blockthe flow or spread of underfill material associated with multipleelectronic components. For example, a barrier can be disposed betweentwo electronic components, which are located on opposite sides of thebarrier. The barrier can therefore be utilized to mechanically block orinhibit underfill material flow on opposing sides of the barrier. Thus,one barrier can be used to define or maintain keep out zones associatedwith multiple electronic components.

As shown in FIG. 8, once the underfill material has hardenedsufficiently (e.g., cured), the barrier can be removed, which can resultin a completed electronic device package 200. As mentioned above, thebarrier can be formed or constructed of a sacrificial material that canfacilitate removal of the barrier so that the underfill barrier haszero, or substantially zero, contribution to the underfill KOZ. Forexample, the sacrificial material may be thermally decomposed into agas, such as at a relatively low temperature (e.g., just above underfillcure temperature) that will not affect or damage other components orfeatures (e.g., the underfill, the electronic component, the substrate,etc.). Therefore, in this example, the barrier may be removed by heatingthe barrier to a temperature sufficient to thermally decompose ordegrade the sacrificial material, while maintaining the temperaturebelow that which would melt or otherwise harm neighboring components ormaterials. Some sacrificial materials can decompose to gases which canvent or diffuse through solid coatings by a thermal decompositionprocess. The decomposition temperature of such sacrificial materials canbe from about 200 degrees C. to about 400 degrees C., for example,although other decomposition temperatures are possible. In anotherexample, the sacrificial material may be soluble, such as by a fluid(e.g., liquid water). Therefore, in this example, the barrier may beremoved by dissolving the sacrificial material in a fluid, such aswater. Thus, some sacrificial materials can be removed by a wash or“deflux” operation, such as water soluble resin-type sacrificialmaterials.

Any suitable sacrificial material having any suitable attribute orcharacteristic may be utilized. For example, the sacrificial materialmay be brittle to readily facilitate cracking or breaking of thesacrificial material for mechanical removal of the barrier withoutdamaging neighboring components. In another example, the sacrificialmaterial may be flexible or elastic to facilitate peeling the barrieraway from interfacing surfaces and materials without damage to theinterfacing surfaces and materials. Some example sacrificial materialsinclude water soluble flux resin, polyethylene carbonates, etc. In aparticular example, Unity® sacrificial material by Promerus may bethermally removed. It should be understood, however, that othersacrificial materials may also find application to the disclosedembodiments.

By forming the barrier of sacrificial material and removing oreliminating the barrier, the barrier does not contribute or factor intothe underfill KOZ, which would otherwise include the barrier'sdimensions. The final shape of the underfill material 230, however, isdirectly influenced by the barrier, which physically contacts theunderfill material and provides the lateral surfaces 233 a, 233 b with ashape formed by interfacing with the barrier. Thus, the electronicdevice package 200 will have features and attributes that indicate theformer presence of the barrier. For example, the lateral surfaces 233 a,233 b will be oriented at angles 236 a, 236 b relative to the substratesurface 211 related to the corresponding angles of the barrier.Depending on the geometry of the barrier, the angles 236 a, 236 b may beless than 90 degrees, although other angles are possible. In addition,the barrier surfaces that interface with the underfill material 230 maybe uneven or irregular due to the manner in which the barrier wasconstructed, which will also be evident on the lateral surfaces 233 a,233 b. As mentioned above, the underfill material 230 can have edges 235a, 235 b between the lateral surfaces 233 a, 233 b and meniscus surfaces234 a, 234 b, respectively, of the underfill material 230. Such featuresare characteristics of an underfill material formed by a barrier thatwas subsequently removed. Furthermore, removal of the barrier may leavea residue 241 a, 241 b (e.g., remains or traces) of the barrier behindon the structures that were in contact with the barrier. For example,sacrificial material (e.g., a water soluble flux resin, polyethylenecarbonates, etc.) may leave a trace or residue on the substrate 210and/or the underfill material 230 following removal of the barrier.Additionally, certain additives in the sacrificial material (e.g.,surfactant additives) that serve to accelerate the decomposition of thematerial can leave a residue (e.g., a stain or other discoloration) onsurfaces in contact with the material, such as portions of the substrateand/or the underfill material.

FIGS. 9-12 schematically illustrate aspects of another process ortechnique for disposing material on a surface of a substrate to form abarrier as disclosed herein. In this case, the barrier is formed byprinting a material (e.g., sacrificial material) on the surface of thesubstrate. For example, as illustrated in FIG. 9, an electroniccomponent 320 can be coupled to a substrate 310 prior to forming abarrier, although it should be recognized that the electronic component320 can be coupled to the substrate 310 after the formation of abarrier. A stencil 360 can be disposed about the substrate 310, as shownin FIG. 10. The stencil 360 can have an aperture or opening 361 a, 361 bcorresponding to a location of the barrier to be formed. The stencilaperture or opening 361 a, 361 b can be configured with any suitablenumber of apertures or openings, such as an array or network of smallholes to allow material to pass through the stencil 360 onto thesubstrate 310 in a suitable arrangement or configuration to form abarrier. The stencil aperture or opening 361 a, 361 b can be locatedabout an entire periphery of the electronic component or an electroniccomponent attachment region, or about only a portion of the electroniccomponent or electronic component attachment region. FIG. 11 illustratessacrificial material 342 passing through the aperture or opening 361 a,361 b in the stencil 360 and transferred onto the substrate 310 to forma barrier 340, as shown in FIG. 12. The location, size, and/or height ofthe barrier 340 on the substrate 310 may be determined by the accuracyof the printing placement, volume, process settings, and designs of thestencil 360. The stencil 360 may be made of material that is non-wet tosacrificial materials or is surface coated with a non-wet material. Withthe barrier 340 in place, the stencil 360 can be removed to provide anelectronic device package precursor as in FIG. 6 if an electroniccomponent has already been coupled to the substrate, or an electronicdevice package precursor as in FIG. 5 if an electronic component has notbeen coupled to the substrate. In either case, with the stencil removed,the sacrificial material can be dried in preparation for application ofan underfill material as discussed above.

It should be recognized that any suitable process or technique may beutilized to form a barrier, such as with a sacrificial material. Inaddition to the examples provided above, a pattern of a barrier may becreated by forming a mask over the substrate and then applying a layerof sacrificial material by spin coating (or other blanket depositiontechnique). It should be appreciated that other processes and/or devicesmay be used to form the desired pattern of barrier material on asubstrate.

FIG. 13 illustrates an example computing system 401. The computingsystem 401 can include an electronic device package 400 as disclosedherein, coupled to a motherboard 470. In one aspect, the computingsystem 401 can also include a processor 471, a memory device 472, aradio 473, a heat sink 474, a port 475, a slot, or any other suitabledevice or component, which can be operably coupled to the motherboard470. The computing system 401 can comprise any type of computing system,such as a desktop computer, a laptop computer, a tablet computer, asmartphone, a server, etc. Other embodiments need not include all of thefeatures specified in FIG. 13, and may include alternative features notspecified in FIG. 13.

EXAMPLES

The following examples pertain to further embodiments.

In one example there is provided, an electronic device packagecomprising a substrate, an electronic component disposed on thesubstrate and electrically coupled to the substrate, and an underfillmaterial disposed at least partially between the electronic componentand the substrate, wherein a lateral portion of the underfill materialcomprises a lateral surface extending away from the substrate andintersecting a meniscus surface extending between the lateral surfaceand the electronic component.

In one example of an electronic device package, the lateral surface isexposed.

In one example of an electronic device package, an intersection of themeniscus surface and the lateral surface defines an edge.

In one example of an electronic device package, the lateral surfacecomprises an irregular surface.

In one example of an electronic device package, a height of the lateralsurface from the substrate is greater than a gap between the electroniccomponent and the substrate.

In one example of an electronic device package, the electronic componentcomprises a semiconductor device.

In one example of an electronic device package, the electronic componentis coupled to the substrate through a plurality of solder bumps.

In one example there is provided, an electronic device packagecomprising a substrate, an electronic component disposed on thesubstrate and electrically coupled to the substrate, and an underfillmaterial disposed at least partially between the electronic componentand the substrate, wherein a lateral portion of the underfill materialextends from a lateral side of the electronic component to thesubstrate, the lateral portion of the underfill material having an edgebetween two surfaces of the underfill material.

In one example of an electronic device package, one of the two surfacesof the underfill material comprises a lateral surface that extends fromthe substrate.

In one example of an electronic device package, the lateral surface isexposed.

In one example of an electronic device package, the lateral surfacecomprises an irregular surface.

In one example of an electronic device package, a height of the lateralsurface from the substrate is greater than a gap between the electroniccomponent and the substrate.

In one example of an electronic device package, the electronic componentcomprises a semiconductor device.

In one example of an electronic device package, the electronic componentis coupled to the substrate through a plurality of solder bumps.

In one example there is provided, an electronic device packagecomprising a substrate, an electronic component disposed on thesubstrate and electrically coupled to the substrate, an underfillmaterial disposed at least partially between the electronic componentand the substrate, the underfill material having a lateral portion thatextends from a lateral side of the electronic component to thesubstrate, and a sacrificial material residue remaining from a barrieron at least one of the substrate and the lateral portion of theunderfill material.

In one example of an electronic device package, the lateral portion ofthe underfill material comprises a lateral surface extending away fromthe substrate and a meniscus surface extending between the lateralsurface and the electronic component.

In one example of an electronic device package, the sacrificial materialresidue remains on the lateral surface.

In one example of an electronic device package, the lateral surface isexposed.

In one example of an electronic device package, an interface of themeniscus surface and the lateral surface defines an edge.

In one example of an electronic device package, the lateral surfacecomprises an irregular surface.

In one example of an electronic device package, a height of the lateralsurface from the substrate is greater than a gap between the electroniccomponent and the substrate.

In one example of an electronic device package, the electronic componentcomprises a semiconductor device.

In one example of an electronic device package, the electronic componentis coupled to the substrate through a plurality of solder bumps.

In one example, there is provided a computing system comprising amotherboard, and an electronic device package as disclosed hereinoperably coupled to the motherboard.

In one example of a computing system, the computing system comprises adesktop computer, a laptop, a tablet, a smartphone, a server, or acombination thereof.

In one example of a computing system, the computing system furthercomprises a processor, a memory device, a heat sink, a radio, a slot, aport, or a combination thereof operably coupled to the motherboard.

In one example, there is provided an electronic device package precursorcomprising a substrate having an electronic component region, and asacrificial material disposed on the substrate to form a barrier aboutat least a portion of the electronic component region to mechanicallyinhibit flow of an underfill material.

In one example of an electronic device package precursor, a height ofthe sacrificial material from the substrate is greater than a gapbetween the electronic component and the substrate.

In one example, an electronic device package precursor further comprisesan electronic component disposed on the substrate and electricallycoupled to the substrate.

In one example of an electronic device package precursor, the electroniccomponent comprises a semiconductor device.

In one example of an electronic device package precursor, the electroniccomponent is coupled to the substrate through a plurality of solderbumps.

In one example, an electronic device package precursor further comprisesthe underfill material disposed at least partially between theelectronic component and the substrate, the underfill material having alateral surface defined at least in part by the sacrificial material.

In one example of an electronic device package precursor, the lateralsurface extends away from the substrate, and a height of the lateralsurface from the substrate is greater than a gap between the electroniccomponent and the substrate.

In one example of an electronic device package precursor, thesacrificial material is thermally decomposable.

In one example of an electronic device package precursor, thesacrificial material is water soluble.

In one example there is provided a method for making an electronicdevice package comprising disposing an electronic component on asubstrate, such that the electronic component is electrically coupled tothe substrate, forming a barrier with a sacrificial material about atleast a portion of the electronic component, disposing an underfillmaterial at least partially between the electronic component and thesubstrate, wherein flow of the underfill material is mechanicallyinhibited at least partially by the barrier, and removing the barrier.

In one example of a method for making an electronic device package,forming the barrier comprises dispensing the sacrificial material on thesubstrate.

In one example of a method for making an electronic device package,forming the barrier comprises printing the sacrificial material on thesubstrate.

In one example of a method for making an electronic device package,printing the sacrificial material on the substrate comprises disposing astencil about the substrate, the stencil having an aperturecorresponding to a location of the barrier.

In one example of a method for making an electronic device package,printing the sacrificial material on the substrate further comprisescausing the sacrificial material to pass through the aperture and ontothe substrate.

In one example of a method for making an electronic device package,printing the sacrificial material on the substrate further comprisesremoving the stencil.

In one example of a method for making an electronic device package,printing the sacrificial material on the substrate further comprisesdrying the sacrificial material.

In one example of a method for making an electronic device package,removing the barrier comprises heating the sacrificial material.

In one example of a method for making an electronic device package, thesacrificial material is thermally decomposed.

In one example of a method for making an electronic device package,removing the barrier comprises dissolving the sacrificial material.

In one example of a method for making an electronic device package, thesacrificial material is water soluble.

In one example there is provided a method for making an electronicdevice package comprising obtaining a substrate having an electroniccomponent region, and a sacrificial material on the substrate forming abarrier about at least a portion of the electronic component region,disposing an electronic component on a substrate in the electroniccomponent region, such that the electronic component is electricallycoupled to the substrate, disposing an underfill material at leastpartially between the electronic component and the substrate, whereinflow of the underfill material is mechanically inhibited at leastpartially by the barrier, and removing the barrier.

In one example of a method for making an electronic device package,removing the barrier comprises heating the sacrificial material.

In one example of a method for making an electronic device package, thesacrificial material is thermally decomposed.

In one example of a method for making an electronic device package,removing the barrier comprises dissolving the sacrificial material.

In one example of a method for making an electronic device package, thesacrificial material is water soluble.

In one example there is provided a method for facilitating an underfillmaterial keep out zone (KOZ) of an electronic component comprisingobtaining a substrate having an electronic component region, anddisposing a sacrificial material on the substrate to form a barrierabout at least a portion of the electronic component region tomechanically inhibit flow of an underfill material.

In one example of a method for facilitating an underfill KOZ of anelectronic component, disposing a sacrificial material on the substratecomprises dispensing the sacrificial material on the substrate.

In one example of a method for facilitating an underfill KOZ of anelectronic component, disposing a sacrificial material on the substratecomprises printing the sacrificial material on the substrate.

In one example of a method for facilitating an underfill KOZ of anelectronic component, printing the sacrificial material on the substratecomprises disposing a stencil about the substrate, the stencil having anaperture corresponding to a location of the barrier.

In one example of a method for facilitating an underfill KOZ of anelectronic component, printing the sacrificial material on the substratefurther comprises causing the sacrificial material to pass through theaperture and onto the substrate.

In one example of a method for facilitating an underfill KOZ of anelectronic component, printing the sacrificial material on the substratefurther comprises removing the stencil.

In one example of a method for facilitating an underfill KOZ of anelectronic component, printing the sacrificial material on the substratefurther comprises drying the sacrificial material.

In one example of a method for facilitating an underfill KOZ of anelectronic component, the sacrificial material is thermallydecomposable.

In one example of a method for facilitating an underfill KOZ of anelectronic component, the sacrificial material is water soluble.

Circuitry used in electronic components or devices (e.g. a die) of anelectronic device package can include hardware, firmware, program code,executable code, computer instructions, and/or software. Electroniccomponents and devices can include a non-transitory computer readablestorage medium which can be a computer readable storage medium that doesnot include signal. In the case of program code execution onprogrammable computers, the computing devices recited herein may includea processor, a storage medium readable by the processor (includingvolatile and non-volatile memory and/or storage elements), at least oneinput device, and at least one output device. Volatile and non-volatilememory and/or storage elements may be a RAM, EPROM, flash drive, opticaldrive, magnetic hard drive, solid state drive, or other medium forstoring electronic data. Node and wireless devices may also include atransceiver module, a counter module, a processing module, and/or aclock module or timer module. One or more programs that may implement orutilize any techniques described herein may use an applicationprogramming interface (API), reusable controls, and the like. Suchprograms may be implemented in a high level procedural or objectoriented programming language to communicate with a computer system.However, the program(s) may be implemented in assembly or machinelanguage, if desired. In any case, the language may be a compiled orinterpreted language, and combined with hardware implementations.

While the forgoing examples are illustrative of the specific embodimentsin one or more particular applications, it will be apparent to those ofordinary skill in the art that numerous modifications in form, usage anddetails of implementation can be made without departing from theprinciples and concepts articulated herein.

What is claimed is:
 1. A method for making an electronic device package,comprising: disposing an electronic component on a substrate, such thatthe electronic component is electrically coupled to the substrate;forming a barrier with a sacrificial material about at least a portionof the electronic component; disposing an underfill material at leastpartially between the electronic component and the substrate, whereinflow of the underfill material is mechanically inhibited at leastpartially by the barrier; and removing the barrier.
 2. The method ofclaim 1, wherein forming the barrier comprises dispensing thesacrificial material on the substrate.
 3. The method of claim 1, whereinforming the barrier comprises printing the sacrificial material on thesubstrate.
 4. The method of claim 3, wherein printing the sacrificialmaterial on the substrate comprises disposing a stencil about thesubstrate, the stencil having an aperture corresponding to a location ofthe barrier.
 5. The method of claim 4, wherein printing the sacrificialmaterial on the substrate further comprises causing the sacrificialmaterial to pass through the aperture and onto the substrate.
 6. Themethod of claim 5, wherein printing the sacrificial material on thesubstrate further comprises removing the stencil.
 7. The method of claim5, wherein printing the sacrificial material on the substrate furthercomprises drying the sacrificial material.
 8. The method of claim 1,wherein removing the barrier comprises heating the sacrificial material.9. The method of claim 8, wherein the sacrificial material is thermallydecomposed.
 10. The method of claim 1, wherein removing the barriercomprises dissolving the sacrificial material.
 11. The method of claim10, wherein the sacrificial material is water soluble.
 12. A method formaking an electronic device package, comprising: obtaining a substratehaving an electronic component region, and a sacrificial material on thesubstrate forming a barrier about at least a portion of the electroniccomponent region; disposing an electronic component on a substrate inthe electronic component region, such that the electronic component iselectrically coupled to the substrate; disposing an underfill materialat least partially between the electronic component and the substrate,wherein flow of the underfill material is mechanically inhibited atleast partially by the barrier; and removing the barrier.
 13. The methodof claim 12, wherein removing the barrier comprises heating thesacrificial material.
 14. The method of claim 13, wherein thesacrificial material is thermally decomposed.
 15. The method of claim12, wherein removing the barrier comprises dissolving the sacrificialmaterial.
 16. The method of claim 15, wherein the sacrificial materialis water soluble.
 17. A method for facilitating an underfill materialkeep out zone (KOZ) of an electronic component, comprising: obtaining asubstrate having an electronic component region; and disposing asacrificial material on the substrate to form a barrier about at least aportion of the electronic component region to mechanically inhibit flowof an underfill material.
 18. The method of claim 17, wherein disposinga sacrificial material on the substrate comprises dispensing thesacrificial material on the substrate.
 19. The method of claim 17,wherein disposing a sacrificial material on the substrate comprisesprinting the sacrificial material on the substrate.
 20. The method ofclaim 19, wherein printing the sacrificial material on the substratecomprises disposing a stencil about the substrate, the stencil having anaperture corresponding to a location of the barrier.
 21. The method ofclaim 20, wherein printing the sacrificial material on the substratefurther comprises causing the sacrificial material to pass through theaperture and onto the substrate.
 22. The method of claim 21, whereinprinting the sacrificial material on the substrate further comprisesremoving the stencil.
 23. The method of claim 21, wherein printing thesacrificial material on the substrate further comprises drying thesacrificial material.
 24. The method of claim 17, wherein thesacrificial material is thermally decomposable.
 25. The method of claim17, wherein the sacrificial material is water soluble.